Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA35002-20P/CU/2.6BU

DigiKey Part Number
4573-MBA35002-20P/CU/2.6BU-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA35002-20P/CU/2.6BU
Description
CU HEAT SINK 35X35X20MM WITH PIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.378" (35.00mm)
Width
1.378" (35.00mm)
Diameter
-
Fin Height
0.670" (17.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

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In-Stock: 32
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Quantity
All prices are in HUF
Tray
QuantityUnit PriceExt Price
11 829,33000 Ft1 829,33 Ft
101 618,72400 Ft16 187,24 Ft
251 541,92320 Ft38 548,08 Ft
501 486,21340 Ft74 310,67 Ft
1001 432,50180 Ft143 250,18 Ft
2501 364,34012 Ft341 085,03 Ft
5001 314,91446 Ft657 457,23 Ft
1 0001 267,21052 Ft1 267 210,52 Ft
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Unit Price without VAT:1 829,33000 Ft
Unit Price with VAT:2 323,24910 Ft
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