Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA33002-21P/CU/3.4Y

DigiKey Part Number
4573-MBA33002-21P/CU/3.4Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA33002-21P/CU/3.4Y
Description
CU HEAT SINK 33X33X21MM WITH PIN
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Filter Similar Products
Show Empty Attributes
Category
Attachment Method
Clip
Mfr
Shape
Square, Pin Fins
Series
Length
1.299" (33.00mm)
Packaging
Tray
Width
1.299" (33.00mm)
Part Status
Active
Fin Height
0.709" (18.00mm)
Type
Top Mount
Material
Package Cooled
Report Product Information Error
Environmental & Export Classifications
Product Questions and Answers
Additional Resources
In-Stock: 38
Check for Additional Incoming Stock
Quantity
All prices are in HUF
Tray
QuantityUnit PriceExt Price
11 813,68000 Ft1 813,68 Ft
101 604,87700 Ft16 048,77 Ft
251 528,73320 Ft38 218,33 Ft
501 473,49980 Ft73 674,99 Ft
1001 420,24780 Ft142 024,78 Ft
2501 352,66924 Ft338 167,31 Ft
5001 303,66636 Ft651 833,18 Ft
1 0001 256,37050 Ft1 256 370,50 Ft
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Unit Price without VAT:1 813,68000 Ft
Unit Price with VAT:2 303,37360 Ft
Associated Product
1 Items
EP4CE6E22C8N

EP4CE6E22C8N

IC FPGA 91 I/O 144EQFP

Altera

5 657,46000 Ft
You May Also Be Interested InSee All
2 Items
HBH37.5031-10/CU

HBH37.5031-10/CU

CU HEAT SINK 37.5X37.5X10MM WITH

Malico Inc.

2 164,22000 Ft
HBA25031-10/CU/Y

HBA25031-10/CU/Y

CU HEAT SINK 25X25X10MM WITH LIN

Malico Inc.

1 694,80000 Ft
Terms & Conditions Privacy Notice Cookie Settings
Copyright © 1995-2026, DigiKey. All Rights Reserved.
ECIA Member
This site is protected by VikingCloud's Trusted Commerce program
ECIA Member