Heat Sink BGA Copper Top Mount
Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

MBA37.5002-28P/CU/3.2Y

DigiKey Part Number
4573-MBA37.5002-28P/CU/3.2Y-ND
Manufacturer
Malico Inc.
Manufacturer Product Number
MBA37.5002-28P/CU/3.2Y
Description
CU HEAT SINK 37.5X37.5X28MM WITH
Manufacturer Standard Lead Time
5 Weeks
Customer Reference
Detailed Description
Heat Sink BGA Copper Top Mount
Product Attributes
Type
Description
Select All
Category
Mfr
Malico Inc.
Series
MBA
Packaging
Tray
Part Status
Active
Type
Top Mount
Package Cooled
BGA
Attachment Method
Clip
Shape
Square, Pin Fins
Length
1.476" (37.50mm)
Width
1.476" (37.50mm)
Diameter
-
Fin Height
0.984" (25.00mm)
Power Dissipation @ Temperature Rise
-
Thermal Resistance @ Forced Air Flow
-
Thermal Resistance @ Natural
-
Material
Copper
Material Finish
-
Product Questions and Answers

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In-Stock: 98
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Quantity
All prices are in HUF
Tray
QuantityUnit PriceExt Price
12 007,65000 Ft2 007,65 Ft
101 776,44600 Ft17 764,46 Ft
351 662,07457 Ft58 172,61 Ft
701 601,99014 Ft112 139,31 Ft
1051 567,84857 Ft164 624,10 Ft
2801 488,13486 Ft416 677,76 Ft
5251 439,12952 Ft755 543,00 Ft
1 0151 389,42865 Ft1 410 270,08 Ft
Manufacturers Standard Package
Note: Due to DigiKey value-add services the packaging type may change when product is purchased at quantities beneath the standard package.
Unit Price without VAT:2 007,65000 Ft
Unit Price with VAT:2 549,71550 Ft
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