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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.
374324B00035G | |
|---|---|
DigiKey Part Number | HS318-ND |
Manufacturer | |
Manufacturer Product Number | 374324B00035G |
Description | HEATSINK BGA W/ADHESIVE TAPE |
Manufacturer Standard Lead Time | 14 Weeks |
Customer Reference | |
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level |
Datasheet | Datasheet |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Box | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | ||
Attachment Method | Thermal Tape, Adhesive (Included) | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 3.0W @ 90°C | |
Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Shelf Life | - | |
Base Product Number |
In-Stock: 2 483
Check for Additional Incoming Stock
Non-Cancelable/Non-Returnable
Quantity
All prices are in HUF
Box
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1 | 814,74000 Ft | 814,74 Ft |
| 10 | 720,35500 Ft | 7 203,55 Ft |
| 25 | 686,10560 Ft | 17 152,64 Ft |
| 50 | 661,38640 Ft | 33 069,32 Ft |
| 100 | 637,49760 Ft | 63 749,76 Ft |
| 250 | 607,18916 Ft | 151 797,29 Ft |
| 756 | 572,48329 Ft | 432 797,37 Ft |
| 1 512 | 551,73041 Ft | 834 216,38 Ft |
| 5 292 | 516,05529 Ft | 2 730 964,59 Ft |
| Unit Price without VAT: | 814,74000 Ft |
|---|---|
| Unit Price with VAT: | 1 034,71980 Ft |
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