SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays

Samtec's ultra high-density, high-speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings

Image of Samtec's SEARAY™ 0.80 mm Pitch Ultra High-Density Arrays Samtec's ultra high-density, high-speed open-pin-field arrays feature a 0.80 mm pitch grid for up to 50% board space savings compared to 0.050" pitch SEARAY interconnects. With up to 720 total Edge Rate® contacts optimized for signal integrity, this system allows for maximum grounding and routing flexibility. Features include up to 12 rows and 60 contacts per row, choice of 7 mm or 10 mm stack height, and high-speed 56 Gbps PAM4 performance. The arrays are available in vertical and right-angle orientations.

SEARAY 0.80 mm connectors are a Severe Environment Test (SET) qualified product. SET is a Samtec initiative to test products beyond typical industry standards and specifications. These products undergo additional testing to ensure they are more than suitable for rugged/harsh environments such as military, space, automotive, industrial, and other extreme applications.

Features
  • 56 Gbps PAM4 performance (28 Gbps with right-angle version)
  • 50% board space savings versus 1.27 mm (0.050") pitch SEARAY
  • Up to 720 I/Os
  • 7 mm and 10 mm stack heights
  • Maximum grounding and routing flexibility
  • Rugged Edge Rate contact system
  • Lower insertion/withdrawal forces
  • Solder charge termination
  • SET qualified product
Applications
  • Computer equipment
  • Computer peripheral equipment
  • Computer storage devices
  • Communications equipment
  • Search/navigation equipment
  • Medical laboratories
  • Optical instruments/lenses
Industries
  • Datacom
  • Computer/semiconductor
  • Instrumentation
  • Medical
  • Aerospace/defense
  • Military
  • Industrial
  • Auto/trans/telematics

Resources

Published: 2021-07-01