Quick Dive Information on the Latest Product Additions and New Components.
Mechatronics' low-power fans provide the efficiency of a DC fan with the simplicity of connecting to an AC power supply.
3M™ 9876 thermally conductive and heat spreading tape provides heat dissipation with a preferential heat-transfer path through heat-generating components.
Wakefield-Vette’s HPLC-RM series is a refrigerant-free temperature control device mountable in a 19-inch rack.
Delta's commercial refrigerator fans and motors provide outstanding reliability and improved power efficiency compared to traditional AC fans and motors.
CUI's AF and SF series of thermal conductive pads offer packages from 10 mm x 10 mm to 70 mm x 70 mm and are designed with non-silicone or silicone elastomer.
Mechatronics fan trays deliver high airflow and low power consumption rack mountable thermal management solutions.
Taica’s COH-3114LVC thermal interface sheet material (TIM) is available in a variety of thicknesses and can be custom-cut to fit any design or application.
Orion’s LFG heavy-duty filter fan kit series prevents dust, dirt and moisture from entering enclosures available in a variety of options and fan sizes.
CUI's HSS series of heat sinks features high thermal conductivity to improve heat dissipation and are available with and without solder pins.
Orion Fans are designed for use in equipment where permanent, cleanable filters are most appropriate, such as networking, telecom and communications enclosures.
Explore Panasonic technologies like active and passive components, energy solutions, industrial automation and more.
Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.
3M™ series 8926 thermally conductive interface tapes are filled with conductive ceramic particles for good converting availability, handling, and reworkability.
Parker Chomerics' THERM-A-GAP™ 976 features fiberglass reinforced for improved tear strength and improved rework capabilities.
Parker Chomerics' THERM-A-GAP™ 974 is supplied with pressure sensitive adhesive for ease of use.
Parker Chomerics' T670 thermal grease with 3.0 W/m-K thermal conductivity is ideal for applications requiring thin bond lines.
Parker Chomerics' THERM-A-FORM is a dispensable form-in-place compound designed for heat transfer without compressive force in electronics cooling applications.
Parker Chomerics' THERMFLOW T558 is designed to completely fill interfacial air gaps and voids within electronics assemblies.
Parker Chomerics' THERMATTACH® T411 provides bonding between electronic components and heat sinks, notably on plastic packages and low surface energy materials.
Parker Chomerics' THERMATTACH® T412 provides superior thermal conductivity and exceptional bonding properties between electronic components and heatsinks.
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